Monogoto and Nordic Semiconductor have announced a strategic collaboration to advance the nuSIM ecosystem, which integrates SIM technology into IoT devices. This partnership aims to streamline connectivity and enhance security for developers and manufacturers.
The Advanced Semiconductor R&D Center has officially broken ground at the headquarters campus of the Industrial Technology Research Institute (ITRI) in Hsinchu. The post ITRI Breaks Ground on Advanced Semiconductor R&D Center Featuring a 12-Inch Pilot Line appeared first on Semiconductor Digest.
AMD and Tata Consultancy Services (TCS) are collaborating to develop the Helios rack-scale AI architecture in India. This initiative aims to support national AI initiatives and enhance operational efficiencies for enterprises.
POET Technologies has been awarded an Elite Score and category win in the Lightwave Innovation Review's 13th annual awards for its Teralight optical engines. The recognition highlights the company's advancements in AI connectivity solutions amidst growing industry demands.
GlobalFoundries and Renesas have announced a multi-billion-dollar partnership to enhance semiconductor manufacturing in the U.S. This collaboration aims to secure supply chains and support the growing demand for advanced technologies in the automotive and industrial sectors.
At IEEE ISSCC 2026, imec revealed a groundbreaking 7-bit, 175GS/s ADC that combines a compact footprint with low energy consumption. This innovation addresses the growing demands of AI and cloud-driven data centers.
Keysight Technologies has launched the 3D Interconnect Designer, aimed at simplifying the design of complex 3D interconnects for chiplet and 3DIC packages. This new tool enhances efficiency and reduces development cycles in advanced packaging applications.
The Device Research Conference (DRC) has announced its Call for Papers for the 2026 event, celebrating its 84th anniversary. The conference will take place from June 21-24, 2026, at the University of Michigan, focusing on advancements in device science and technology.
Tower Semiconductor and Scintil Photonics have announced the availability of the world's first heterogeneously integrated Dense Wavelength Division Multiplexing (DWDM) lasers designed for AI infrastructure. This innovation aims to improve bandwidth density and energy efficiency in next-generation AI applications.
Lam Research has inaugurated a new office in Boise, Idaho, aimed at supporting high-volume manufacturing of advanced memory technology. This expansion reflects the company's commitment to enhancing operations in the U.S. semiconductor sector.
CEA-List and CEA-Leti have introduced the first electro-optical router with dynamic optical routing integrated with CMOS control logic. This innovation enables faster and more efficient optical communication within advanced chiplet-based packages.
LINTEC has launched a new resin coating process called Pattern Coating Before Lamination (PCBL) to improve the flatness of semiconductor wafers during back grinding. This innovative method addresses thickness variations caused by step height differences, enhancing the quality of semiconductor chips.
EV Group has introduced the EVG120, an advanced resist processing system that offers higher throughput and flexibility for semiconductor manufacturing. This next-generation platform is optimized for various applications, including advanced packaging and MEMS.
Home Affairs Minister Tony Burke has accused the Coalition of hypocrisy regarding the repatriation of Australians from Syria. He highlighted the opposition's previous actions while in government during an interview on ABC's 7.30 program.
An Antarctic expedition has recently concluded in New Zealand, with scientists preparing for future explorations. Stay tuned for more updates on their findings and upcoming missions.