The Advanced Semiconductor R&D Center has officially broken ground at the headquarters campus of the Industrial Technology Research Institute (ITRI) in Hsinchu. The post ITRI Breaks Ground on Advanced Semiconductor R&D Center Featuring a 12-Inch Pilot Line appeared first on Semiconductor Digest.
The Advanced Semiconductor R&D Center has officially broken ground at the headquarters campus of the Industrial Technology Research Institute (ITRI) in Hsinchu.
The post ITRI Breaks Ground on Advanced Semiconductor R&D Center Featuring a 12-Inch Pilot Line appeared first on Semiconductor Digest.
<a href="https://desdunia.com/semiconductors/itri-breaks-ground-on-advanced-semiconductor-rd-center-featuring-a-12-inch-pilot-line" target="_blank" rel="nofollow noopener">ITRI Breaks Ground on Advanced Semiconductor R&D Center Featuring a 12-Inch Pilot Line</a> (Desdunia, 2026-02-16)[ITRI Breaks Ground on Advanced Semiconductor R&D Center Featuring a 12-Inch Pilot Line](https://desdunia.com/semiconductors/itri-breaks-ground-on-advanced-semiconductor-rd-center-featuring-a-12-inch-pilot-line) — Desdunia (2026-02-16)https://desdunia.com/semiconductors/itri-breaks-ground-on-advanced-semiconductor-rd-center-featuring-a-12-inch-pilot-line<blockquote cite="https://desdunia.com/semiconductors/itri-breaks-ground-on-advanced-semiconductor-rd-center-featuring-a-12-inch-pilot-line">ITRI Breaks Ground on Advanced Semiconductor R&D Center Featuring a 12-Inch Pilot Line</blockquote>
<p>Source: <a href="https://desdunia.com/semiconductors/itri-breaks-ground-on-advanced-semiconductor-rd-center-featuring-a-12-inch-pilot-line" target="_blank" rel="nofollow noopener">Desdunia</a></p>Hammond Power Solutions Inc. has announced its agreement to acquire AEG Power Solutions, a global manufacturer of industrial power electronics. This acquisition aims to strengthen HPS's portfolio and expand its market presence across various sectors.
At IEEE ISSCC 2026, imec revealed a groundbreaking 7-bit, 175GS/s ADC that combines a compact footprint with low energy consumption. This innovation addresses the growing demands of AI and cloud-driven data centers.
EV Group has introduced the EVG120, an advanced resist processing system that offers higher throughput and flexibility for semiconductor manufacturing. This next-generation platform is optimized for various applications, including advanced packaging and MEMS.
LINTEC has launched a new resin coating process called Pattern Coating Before Lamination (PCBL) to improve the flatness of semiconductor wafers during back grinding. This innovative method addresses thickness variations caused by step height differences, enhancing the quality of semiconductor chips.
CEA-List and CEA-Leti have introduced the first electro-optical router with dynamic optical routing integrated with CMOS control logic. This innovation enables faster and more efficient optical communication within advanced chiplet-based packages.