Wi-Fi 7 Moves To The IoT
What's behind the widespread adoption of extremely high-throughput wireless. The post Wi-Fi 7 Moves To The IoT appeared first on Semiconductor Engineering.
Semiconductors News
Blog Review: Feb. 18
Agentic disruption; data center PUE; scaling AI; RTOS; dropping toast. The post Blog Review: Feb. 18 appeared first on Semiconductor Engineering.
Router-in-a-Package Design Combining HBM4, Chiplets and In-Package Optics (Technion, Berkeley, UCSD)
A new technical paper “Scaling Routers with In-Package Optics and High-Bandwidth Memories” was posted by researchers at Technion, UC Berkeley and UC San Diego. Abstract “This paper aims to apply two major scaling transformations from the computing packaging industry to internet routers: the heteroge...
Detecting Architectural Vulnerabilities in Closed-Source RISC-V CPUs (CISPA)
The paper “RISCover: Automatic Discovery of User-exploitable Architectural Security Vulnerabilities in Closed-Source RISC-V CPUs” was published by researchers at CISPA Helmholtz Center for Information Security. Abstract “The open and extensible RISC-V instruction set has enabled many new CPU vendors...
Research Bits: Feb. 17
Analog layout foundation model; carbon nanotube sandpaper; low-power optical amplifier. The post Research Bits: Feb. 17 appeared first on Semiconductor Engineering.
Can A Computer Science Student Be Taught To Design Hardware?
To fill the talent gap, CS majors could be taught to design hardware, and the EE curriculum could be adapted or even shortened. The post Can A Computer Science Student Be Taught To Design Hardware? appeared first on Semiconductor Engineering.
The Race Begins For Much Bigger Abstractions In Data Centers
Massive compute capabilities enable a whole new way of manipulating and using data, and a potential bonanza for AI data centers. The post The Race Begins For Much Bigger Abstractions In Data Centers appeared first on Semiconductor Engineering.
One-on-One With proteanTecs CEO Shai Cohen
Inside the whirlwind changes across the chip industry. The post One-on-One With proteanTecs CEO Shai Cohen appeared first on Semiconductor Engineering.
New Class Of Semiconductors Made Of Germanium-Tin Alloy (University of Edinburgh et al.)
A new technical paper “High Pressure and Compositionally Directed Route to a Hexagonal GeSn Alloy Class” was published by researchers at the University of Edinburgh, GFZ Helmholtz Centre for Geosciences, the University of Lille, Grenoble Alpes University, the University of Bayreuth and the European....
Less Power and Higher Performance With A Nanolaser With Extreme Dielectric Confinement (DTU)
A new technical paper titled “A nanolaser with extreme dielectric confinement” was published by researchers at Technical University of Denmark (DTU). Abstract “The interaction between light and matter can be enhanced by spatially concentrating the light field and extending photon dwell time. Plasmon...