LINTEC has launched a new resin coating process called Pattern Coating Before Lamination (PCBL) to improve the flatness of semiconductor wafers during back grinding. This innovative method addresses thickness variations caused by step height differences, enhancing the quality of semiconductor chips.
LINTEC has developed Pattern Coating Before Lamination (PCBL), a process for the back grinding of semiconductor wafers that reduces thickness variation caused by step height differences on the circuit surface.
The post LINTEC Develops Resin Coating Process for Flatter Semiconductor Wafers during Bac...
LINTEC has launched a new resin coating process called Pattern Coating Before Lamination (PCBL) to improve the flatness of semiconductor wafers during back grinding. This innovative method addresses thickness variations caused by step height differences, enhancing the quality of semiconductor chips.
The PCBL process is a new method for back grinding semiconductor wafers that reduces thickness variations caused by step height differences.
The RAD-3400F/12 coater applies UV curable resin to the wafers, allowing customization of the coating to match specific wafer specifications.
LINTEC will begin accepting full-scale orders for the RAD-3400F/12 in April 2026.
The PCBL process helps achieve flatter semiconductor wafers, reduces cracking during grinding, and improves overall chip quality.
Yes, the RAD-3400F/12 can be integrated with LINTEC's existing back grinding tape application systems without requiring line modifications.
<a href="https://desdunia.com/semiconductors/lintec-develops-resin-coating-process-for-flatter-semiconductor-wafers-during-back-grinding" target="_blank" rel="nofollow noopener">LINTEC Develops New Resin Coating Process for Semiconductor Wafers</a> (Desdunia, 2026-02-18)[LINTEC Develops New Resin Coating Process for Semiconductor Wafers](https://desdunia.com/semiconductors/lintec-develops-resin-coating-process-for-flatter-semiconductor-wafers-during-back-grinding) — Desdunia (2026-02-18)https://desdunia.com/semiconductors/lintec-develops-resin-coating-process-for-flatter-semiconductor-wafers-during-back-grinding<blockquote cite="https://desdunia.com/semiconductors/lintec-develops-resin-coating-process-for-flatter-semiconductor-wafers-during-back-grinding">LINTEC Develops New Resin Coating Process for Semiconductor Wafers</blockquote>
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