EV Group has introduced the EVG120, an advanced resist processing system that offers higher throughput and flexibility for semiconductor manufacturing. This next-generation platform is optimized for various applications, including advanced packaging and MEMS.
New ultra-compact platform adds in-situ resist thickness metrology, wafer edge exposure and EVG150-class performance in a smaller-scale, highly flexible format.
The post EV Group Unveils Next-Generation EVG120 Resist Processing System for High-Volume Manufacturing appeared first on Semiconductor...
EV Group has introduced the EVG120, an advanced resist processing system that offers higher throughput and flexibility for semiconductor manufacturing. This next-generation platform is optimized for various applications, including advanced packaging and MEMS.
The EVG120 is an automated resist processing system designed for high-volume semiconductor manufacturing, featuring enhanced capabilities and a compact design.
The EVG120 is ideal for advanced packaging, MEMS, image sensors, photonics, and other fast-growing application areas.
Key features include increased capacity, new capabilities like wafer edge exposure, in-situ resist thickness measurement, and energy-efficient stand-by mode.
The EVG120 will be showcased at the SPIE Advanced Lithography and Patterning Conference in San Jose, California, from February 22-26.
Orders for the EVG120 are currently being accepted, and demonstrations can be arranged at EVG’s corporate headquarters.
<a href="https://desdunia.com/semiconductors/ev-group-unveils-next-generation-evg120-resist-processing-system-for-high-volume-manufacturing" target="_blank" rel="nofollow noopener">EV Group Launches Next-Generation EVG120 Resist Processing System</a> (Desdunia, 2026-02-18)[EV Group Launches Next-Generation EVG120 Resist Processing System](https://desdunia.com/semiconductors/ev-group-unveils-next-generation-evg120-resist-processing-system-for-high-volume-manufacturing) — Desdunia (2026-02-18)https://desdunia.com/semiconductors/ev-group-unveils-next-generation-evg120-resist-processing-system-for-high-volume-manufacturing<blockquote cite="https://desdunia.com/semiconductors/ev-group-unveils-next-generation-evg120-resist-processing-system-for-high-volume-manufacturing">EV Group Launches Next-Generation EVG120 Resist Processing System</blockquote>
<p>Source: <a href="https://desdunia.com/semiconductors/ev-group-unveils-next-generation-evg120-resist-processing-system-for-high-volume-manufacturing" target="_blank" rel="nofollow noopener">Desdunia</a></p>Hammond Power Solutions Inc. has announced its agreement to acquire AEG Power Solutions, a global manufacturer of industrial power electronics. This acquisition aims to strengthen HPS's portfolio and expand its market presence across various sectors.
At IEEE ISSCC 2026, imec revealed a groundbreaking 7-bit, 175GS/s ADC that combines a compact footprint with low energy consumption. This innovation addresses the growing demands of AI and cloud-driven data centers.
LINTEC has launched a new resin coating process called Pattern Coating Before Lamination (PCBL) to improve the flatness of semiconductor wafers during back grinding. This innovative method addresses thickness variations caused by step height differences, enhancing the quality of semiconductor chips.
CEA-List and CEA-Leti have introduced the first electro-optical router with dynamic optical routing integrated with CMOS control logic. This innovation enables faster and more efficient optical communication within advanced chiplet-based packages.
Wi-Fi 7, also known as IEEE 802.11be, is moving from high-end applications to IoT devices like smart locks and thermostats. This transition focuses on supporting multiple simultaneous connections rather than just high-speed connectivity for individual devices.