Chip industry and semiconductor supply chain news.
A team from Incheon National University has developed a comprehensive roadmap for ultra-thin crystalline silicon-based bioelectronics. This innovative material promises to enhance the performance and flexibility of wearable and implantable health devices.
SiTime Corporation has signed an agreement to acquire certain assets of Renesas’ timing business, aiming to enhance its product offerings and accelerate revenue growth. This acquisition is expected to significantly expand SiTime's customer base and product portfolio in the precision timing market.
A team from the Qingdao Institute of Bioenergy and Bioprocess Technology has developed a method to enhance the performance of perovskite solar cells by engineering a thin two-dimensional phase at buried interfaces. This advancement significantly reduces defects and improves efficiency, bringing commercialization closer.
In 2025, global semiconductor sales soared to $791.69 billion, a 26.1% increase from the previous year. The growth was primarily fueled by logic chips and MOS memories, with notable contributions from application-specific chips.
Researchers have developed a new germanium-tin alloy that acts as an effective semiconductor, potentially enhancing the efficiency of electronic devices. This breakthrough could lead to faster operation and reduced energy use in applications like computer processors and medical imaging.
Gelest, Inc. has announced a collaboration with IBM to test precursor materials for dry resist EUV lithography. This partnership aims to accelerate innovation in semiconductor manufacturing, particularly for logic and DRAM technologies.
This article discusses the importance of practical HLS verification in the production of silicon, highlighting key lessons learned to improve design efficiency. It emphasizes early verification, the use of SystemC/C++ models, and the need for a robust verification strategy.
Texas Instruments has announced its acquisition of Silicon Labs for $231 per share, totaling approximately $7.5 billion. This strategic move aims to strengthen Texas Instruments' position in embedded wireless connectivity solutions.
Siemens has announced its acquisition of Canopus AI, a company specializing in AI-driven metrology solutions for semiconductor manufacturing. This move aims to enhance precision and efficiency in wafer and mask inspection processes, addressing the growing challenges in the semiconductor industry.
EV Group will present its cutting-edge solutions for semiconductor manufacturing at SEMICON Korea 2026, including hybrid bonding and layer transfer technologies. The event takes place from February 11-13 at the COEX Exhibition Center in Seoul.
Lam Research Corp. has announced leadership transitions, promoting Sesha Varadarajan to Chief Operating Officer and Karthik Rammohan to Senior Vice President. These changes aim to enhance operational efficiency and support the company's growth in the semiconductor industry.
High NA EUV lithography is revolutionizing chip manufacturing by enhancing resolution, simplifying processes, and offering design flexibility. This technology is crucial for meeting the demands of advanced AI and data-centric applications.
Dassault Systèmes and NVIDIA have formed a strategic partnership to develop an industrial AI platform that integrates Virtual Twin technologies with NVIDIA's AI infrastructure. This collaboration aims to enhance design, simulation, and operation across multiple sectors.
Archer Materials Limited has completed its alpha prototype of a blood potassium sensor integrated with a biochip. This development is crucial for clinical workflows and at-home monitoring of potassium levels, particularly for patients with chronic kidney disease and heart failure.
Northrop Grumman has been awarded a contracting tool from the Defense Microelectronics Activity to expedite military-grade semiconductor technology. This initiative aims to enhance the U.S. supply chain and improve responsiveness in delivering advanced microelectronics solutions.