EV Group Showcases Advanced Semiconductor Technologies at SEMICON Korea 2026
EV Group will present its cutting-edge solutions for semiconductor manufacturing at SEMICON Korea 2026, including hybrid bonding and layer transfer technologies. The event takes place from February 11-13 at the COEX Exhibition Center in Seoul.
These solutions include EVG’s GEMINI FB production wafer bonding systems, the EVG40 D2W die-to-wafer overlay metrology system, the IR LayerRelease layer transfer technology platform and EVG’s high-throughput LITHOSCALE XT maskless exposure system.
The post EV Group Highlights Hybrid and Fusion Bondi...
AI Summary
EV Group will present its cutting-edge solutions for semiconductor manufacturing at SEMICON Korea 2026, including hybrid bonding and layer transfer technologies. The event takes place from February 11-13 at the COEX Exhibition Center in Seoul.
FAQs
What technologies will EV Group showcase at SEMICON Korea 2026?
EV Group will showcase hybrid bonding, layer transfer technologies, and maskless lithography systems.
When is SEMICON Korea 2026 taking place?
SEMICON Korea 2026 will be held from February 11-13 at the COEX Exhibition Center in Seoul.
What is the significance of EVG's technologies?
EVG's technologies are crucial for advancements in high-bandwidth memory, advanced packaging, and MEMS applications.
Where can I find EV Group at the event?
EV Group will exhibit at booth DS26 during SEMICON Korea 2026.
Who is the Regional Sales Manager for EV Group?
Georg Berger is the Regional Sales Manager, Asia/Pacific at EV Group.
AI-assisted summary generated on Feb 18, 2026. Source link below.
<a href="https://desdunia.com/semiconductors/ev-group-highlights-hybrid-and-fusion-bonding-layer-transfer-and-maskless-lithography-technologies-at-semicon-korea-2026" target="_blank" rel="nofollow noopener">EV Group Showcases Advanced Semiconductor Technologies at SEMICON Korea 2026</a> (Desdunia, 2026-02-04)
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[EV Group Showcases Advanced Semiconductor Technologies at SEMICON Korea 2026](https://desdunia.com/semiconductors/ev-group-highlights-hybrid-and-fusion-bonding-layer-transfer-and-maskless-lithography-technologies-at-semicon-korea-2026) — Desdunia (2026-02-04)