Chip industry and semiconductor supply chain news.
Hammond Power Solutions Inc. has announced its agreement to acquire AEG Power Solutions, a global manufacturer of industrial power electronics. This acquisition aims to strengthen HPS's portfolio and expand its market presence across various sectors.
At IEEE ISSCC 2026, imec revealed a groundbreaking 7-bit, 175GS/s ADC that combines a compact footprint with low energy consumption. This innovation addresses the growing demands of AI and cloud-driven data centers.
EV Group has introduced the EVG120, an advanced resist processing system that offers higher throughput and flexibility for semiconductor manufacturing. This next-generation platform is optimized for various applications, including advanced packaging and MEMS.
LINTEC has launched a new resin coating process called Pattern Coating Before Lamination (PCBL) to improve the flatness of semiconductor wafers during back grinding. This innovative method addresses thickness variations caused by step height differences, enhancing the quality of semiconductor chips.
CEA-List and CEA-Leti have introduced the first electro-optical router with dynamic optical routing integrated with CMOS control logic. This innovation enables faster and more efficient optical communication within advanced chiplet-based packages.
Wi-Fi 7, also known as IEEE 802.11be, is moving from high-end applications to IoT devices like smart locks and thermostats. This transition focuses on supporting multiple simultaneous connections rather than just high-speed connectivity for individual devices.
The February 18 blog review covers significant advancements in the semiconductor industry, including AI workforce deployment and power usage effectiveness in data centers. Key insights from industry leaders highlight emerging technologies and collaboration trends.
Researchers from Technion, UC Berkeley, and UCSD have introduced a novel router architecture that integrates HBM4 chiplets and in-package optics. This design aims to achieve a petabit/sec router within a single package, representing a significant advancement in internet router technology.
Lam Research has inaugurated a new office in Boise, Idaho, aimed at supporting high-volume manufacturing of advanced memory technology. This expansion reflects the company's commitment to enhancing operations in the U.S. semiconductor sector.
Tower Semiconductor and Scintil Photonics have announced the availability of the world's first heterogeneously integrated Dense Wavelength Division Multiplexing (DWDM) lasers designed for AI infrastructure. This innovation aims to improve bandwidth density and energy efficiency in next-generation AI applications.
The Device Research Conference (DRC) has announced its Call for Papers for the 2026 event, celebrating its 84th anniversary. The conference will take place from June 21-24, 2026, at the University of Michigan, focusing on advancements in device science and technology.
Keysight Technologies has launched the 3D Interconnect Designer, aimed at simplifying the design of complex 3D interconnects for chiplet and 3DIC packages. This new tool enhances efficiency and reduces development cycles in advanced packaging applications.
GlobalFoundries and Renesas have announced a multi-billion-dollar partnership to enhance semiconductor manufacturing in the U.S. This collaboration aims to secure supply chains and support the growing demand for advanced technologies in the automotive and industrial sectors.
The paper introduces RISCover, a framework designed to detect architectural vulnerabilities in closed-source RISC-V CPUs. Evaluated on multiple CPUs, it reveals previously unknown vulnerabilities, emphasizing the need for improved security analysis methods.
This article highlights recent advancements in semiconductor technology, featuring a foundation model for analog circuit layout, innovative carbon nanotube sandpaper, and an energy-efficient optical amplifier. These developments promise to enhance manufacturing processes and device performance.