Lam Research has inaugurated a new office in Boise, Idaho, aimed at supporting high-volume manufacturing of advanced memory technology. This expansion reflects the company's commitment to enhancing operations in the U.S. semiconductor sector.
The new office will initially support approximately 150 Lam personnel from the greater Boise area focused on collaborative research, development and high-volume manufacturing of Micron's leading-edge memory technology, with room for future growth.
The post Lam Research Deepens Investment in Boise a...
Lam Research has inaugurated a new office in Boise, Idaho, aimed at supporting high-volume manufacturing of advanced memory technology. This expansion reflects the company's commitment to enhancing operations in the U.S. semiconductor sector.
The new office aims to support collaborative research and high-volume manufacturing of advanced memory technology for Micron.
The office will initially support approximately 150 personnel from the Boise area.
The ceremony was attended by U.S. Senator Jim Risch, representatives from Micron Technology, and local government and community leaders.
Lam Research was awarded the Outstanding Front End Equipment Supplier of the Year in 2025 by Micron.
This investment strengthens Idaho's position in semiconductor manufacturing and supports job creation and economic growth in the region.
<a href="https://desdunia.com/semiconductors/lam-research-deepens-investment-in-boise" target="_blank" rel="nofollow noopener">Lam Research Deepens Investment in Boise</a> (Desdunia, 2026-02-17)[Lam Research Deepens Investment in Boise](https://desdunia.com/semiconductors/lam-research-deepens-investment-in-boise) — Desdunia (2026-02-17)https://desdunia.com/semiconductors/lam-research-deepens-investment-in-boise<blockquote cite="https://desdunia.com/semiconductors/lam-research-deepens-investment-in-boise">Lam Research Deepens Investment in Boise</blockquote>
<p>Source: <a href="https://desdunia.com/semiconductors/lam-research-deepens-investment-in-boise" target="_blank" rel="nofollow noopener">Desdunia</a></p>Hammond Power Solutions Inc. has announced its agreement to acquire AEG Power Solutions, a global manufacturer of industrial power electronics. This acquisition aims to strengthen HPS's portfolio and expand its market presence across various sectors.
At IEEE ISSCC 2026, imec revealed a groundbreaking 7-bit, 175GS/s ADC that combines a compact footprint with low energy consumption. This innovation addresses the growing demands of AI and cloud-driven data centers.
EV Group has introduced the EVG120, an advanced resist processing system that offers higher throughput and flexibility for semiconductor manufacturing. This next-generation platform is optimized for various applications, including advanced packaging and MEMS.
LINTEC has launched a new resin coating process called Pattern Coating Before Lamination (PCBL) to improve the flatness of semiconductor wafers during back grinding. This innovative method addresses thickness variations caused by step height differences, enhancing the quality of semiconductor chips.
CEA-List and CEA-Leti have introduced the first electro-optical router with dynamic optical routing integrated with CMOS control logic. This innovation enables faster and more efficient optical communication within advanced chiplet-based packages.