Keysight Technologies has launched the 3D Interconnect Designer, aimed at simplifying the design of complex 3D interconnects for chiplet and 3DIC packages. This new tool enhances efficiency and reduces development cycles in advanced packaging applications.
Keysight Technologies, Inc.
today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio.
The post Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs appeared first on Semiconductor Digest.
Keysight Technologies has launched the 3D Interconnect Designer, aimed at simplifying the design of complex 3D interconnects for chiplet and 3DIC packages. This new tool enhances efficiency and reduces development cycles in advanced packaging applications.
The 3D Interconnect Designer is a tool introduced by Keysight Technologies to simplify the design of complex 3D interconnects for chiplet and 3DIC advanced packages.
Key benefits include accelerated design cycles, reduced compliance risk, and accurate performance predictions through electromagnetic-based simulations.
The 3D Interconnect Designer can be integrated with Keysight's EDA tools and also supports standalone use, allowing for flexible workflow incorporation.
The tool is aimed at engineers working on chiplet architectures and advanced packaging designs in sectors like AI and data centers.
It addresses the complexities of designing 3D interconnects, which can lead to longer development cycles and increased costs if not managed efficiently.
<a href="https://desdunia.com/semiconductors/keysight-unveils-3d-interconnect-designer-for-chiplet-and-3dic-advanced-package-designs" target="_blank" rel="nofollow noopener">Keysight Launches 3D Interconnect Designer for Advanced Packaging</a> (Desdunia, 2026-02-17)[Keysight Launches 3D Interconnect Designer for Advanced Packaging](https://desdunia.com/semiconductors/keysight-unveils-3d-interconnect-designer-for-chiplet-and-3dic-advanced-package-designs) — Desdunia (2026-02-17)https://desdunia.com/semiconductors/keysight-unveils-3d-interconnect-designer-for-chiplet-and-3dic-advanced-package-designs<blockquote cite="https://desdunia.com/semiconductors/keysight-unveils-3d-interconnect-designer-for-chiplet-and-3dic-advanced-package-designs">Keysight Launches 3D Interconnect Designer for Advanced Packaging</blockquote>
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