Monolithic Power Systems Announces CFO Transition
Monolithic Power Systems, Inc. has announced the retirement of Bernie Blegen as CFO, effective after the 2025 annual report. Rob Dean, the current Corporate Controller, will take over as interim CFO.
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LINTEC Develops New Resin Coating Process for Semiconductor Wafers
LINTEC has launched a new resin coating process called Pattern Coating Before Lamination (PCBL) to improve the flatness of semiconductor wafers during back grinding. This innovative method addresses thickness variations caused by step height differences, enhancing the quality of semiconductor chips.
CEA Unveils First Dynamically Routed Electro-Optical Router
CEA-List and CEA-Leti have introduced the first electro-optical router with dynamic optical routing integrated with CMOS control logic. This innovation enables faster and more efficient optical communication within advanced chiplet-based packages.
Lam Research Deepens Investment in Boise
Lam Research has inaugurated a new office in Boise, Idaho, aimed at supporting high-volume manufacturing of advanced memory technology. This expansion reflects the company's commitment to enhancing operations in the U.S. semiconductor sector.
Tower Semiconductor and Scintil Photonics Launch DWDM Lasers for AI
Tower Semiconductor and Scintil Photonics have announced the availability of the world's first heterogeneously integrated Dense Wavelength Division Multiplexing (DWDM) lasers designed for AI infrastructure. This innovation aims to improve bandwidth density and energy efficiency in next-generation AI applications.
2026 Device Research Conference Announces Call for Papers
The Device Research Conference (DRC) has announced its Call for Papers for the 2026 event, celebrating its 84th anniversary. The conference will take place from June 21-24, 2026, at the University of Michigan, focusing on advancements in device science and technology.
Keysight Launches 3D Interconnect Designer for Advanced Packaging
Keysight Technologies has launched the 3D Interconnect Designer, aimed at simplifying the design of complex 3D interconnects for chiplet and 3DIC packages. This new tool enhances efficiency and reduces development cycles in advanced packaging applications.
GlobalFoundries and Renesas Expand Partnership for Semiconductor Manufacturing
GlobalFoundries and Renesas have announced a multi-billion-dollar partnership to enhance semiconductor manufacturing in the U.S. This collaboration aims to secure supply chains and support the growing demand for advanced technologies in the automotive and industrial sectors.
Victor Peng Joins Rambus Board of Directors
Rambus Inc. has appointed Victor Peng to its Board of Directors, effective February 12, 2026. With extensive experience in the semiconductor industry, Peng aims to enhance Rambus's position in AI and data center markets.
POET Technologies Wins Lightwave Award for Advanced AI Connectivity
POET Technologies has been awarded an Elite Score and category win in the Lightwave Innovation Review's 13th annual awards for its Teralight optical engines. The recognition highlights the company's advancements in AI connectivity solutions amidst growing industry demands.
AMD and TCS to Introduce Helios Rack-Scale AI Architecture in India
AMD and Tata Consultancy Services (TCS) are collaborating to develop the Helios rack-scale AI architecture in India. This initiative aims to support national AI initiatives and enhance operational efficiencies for enterprises.
ITRI Breaks Ground on Advanced Semiconductor R&D Center Featuring a 12-Inch Pilot Line
The Advanced Semiconductor R&D Center has officially broken ground at the headquarters campus of the Industrial Technology Research Institute (ITRI) in Hsinchu. The post ITRI Breaks Ground on Advanced Semiconductor R&D Center Featuring a 12-Inch Pilot Line appeared first on Semiconductor Digest.
Hammond Power Solutions to Acquire AEG Power Solutions
Hammond Power Solutions Inc. has announced its agreement to acquire AEG Power Solutions, a global manufacturer of industrial power electronics. This acquisition aims to strengthen HPS's portfolio and expand its market presence across various sectors.
Imec Unveils 7-Bit, 175GS/s Massively Time-Interleaved Slope-ADC
At IEEE ISSCC 2026, imec revealed a groundbreaking 7-bit, 175GS/s ADC that combines a compact footprint with low energy consumption. This innovation addresses the growing demands of AI and cloud-driven data centers.
EV Group Launches Next-Generation EVG120 Resist Processing System
EV Group has introduced the EVG120, an advanced resist processing system that offers higher throughput and flexibility for semiconductor manufacturing. This next-generation platform is optimized for various applications, including advanced packaging and MEMS.
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